I mostly agree, but if you go further back in the supply chain there are a number of common inputs/tools. For example, as 2025 the new LPDDR lines are using EUV systems, which means for new fab production both DRAM and logic producers are competing for machines from ASML.
It doesn't change your point that these lines are different and the immediate price spike is not about them competing for capacity in the same facilities, but the fact that manufacturers are committing to large enough future purchases to drive new fab construction means that future pricing outlook (which does impact the current prices to extent) does involve some amount of competition between different types of semiconductor products.
It doesn't change your point that these lines are different and the immediate price spike is not about them competing for capacity in the same facilities, but the fact that manufacturers are committing to large enough future purchases to drive new fab construction means that future pricing outlook (which does impact the current prices to extent) does involve some amount of competition between different types of semiconductor products.